CONDUCTIVE COMPOUND IC-PS30CD
CONDUCTIVE COMPOUND IC-PS30CD
Physical Property
| Items | Method of experiment | Unit | Value |
| Carrier Resin | DSC | PS | |
| Carbon Black Content | ASTM D1603 | % | 30 |
| Melt Temperature | DSC | 0C | 150-170 |
| Density | ASTM D1895 | g/cm3 | 1.13 |
| Melt Flow Index (2000C/5kg) | ASTM D1238 | g/10 min | 2.5 |
| Moisture content | ASTM D644 | % | 0.17 |
| Surface Resistivity | – | Ohm | 105-106 |
Processing Technique: Injection molding, thermoforming
Application Rate: 70-100% compound depending on requirement
Packing: 20 kg/bag
Storage: Keep at dry condition
THÔNG TIN SẢN PHẨM
General Description
IC-PS30CD is a pioneer in the manufacture of electrically conductive compounds. We have an exhaustive range of electrically conductive compounds. These range from mild antistatic to the stronger ESD compounds with very low surface and volume resistivity and excellent conductivity. These compounds offer an excellent mix of conductivity, mechanical properties and overall surface finish.
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