CONDUCTIVE COMPOUND IC-PS30CD


CONDUCTIVE COMPOUND IC-PS30CD

Physical Property 

Items  Method of experiment  Unit  Value 
Carrier Resin  DSC    PS 
Carbon Black Content  ASTM D1603  %  30 
Melt Temperature  DSC  0C  150-170 
Density  ASTM D1895  g/cm3  1.13 
Melt Flow Index (2000C/5kg)  ASTM D1238  g/10 min  2.5 
Moisture content  ASTM D644  %  0.17 
Surface Resistivity    Ohm  105-106 

 

Processing Technique: Injection molding, thermoforming 

Application Rate: 70-100% compound depending on requirement 

Packing: 20 kg/bag 

Storage: Keep at dry condition 

THÔNG TIN SẢN PHẨM

General Description 

IC-PS30CD is a pioneer in the manufacture of electrically conductive compounds. We have an exhaustive range of electrically conductive compounds. These range from mild antistatic to the stronger ESD compounds with very low surface and volume resistivity and excellent conductivity. These compounds offer an excellent mix of conductivity, mechanical properties and overall surface finish. 

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