FILLER COMPOUND IC-PS20T


FILLER COMPOUND IC-PS20T

Physical Property 

Items  Method of experiment  Unit  Value 
Carrier Resin  DSC    PS 
Type of Filler      Talc 
Melting Temperature  DSC  0C  150-170 
Density  ASTM 1985  g/cm3  1.1 
Melt Index (2000C/5kg)  ASTMD1238  g/10 mins  7 

 

Processing Technique: Injection molding, thermoforming 

Application Rate: 3-5% compound depending on requirement 

Packing: 20 kg/bag 

Storage: Keep at dry condition 

PRODUCT INFORMATION

General Description 

IC-PS20T is a talc filled polystyrene, with high melt flow rate, good impact/stiffness balance, this grade has been specially developed for interior trim applications, that required an excellent impact test associated with a high modulus. Talc compound providing functional characteristics such as high cell nucleation can be used to achieve polymer foams with improved mechanical properties, further extending the field of application of these materials. Using IC-PS20T to controlled cell size improves mechanical properties and dimensional stability, allowing manufacturers to reduce material costs, control cell morphology and produce high-quality foams. 

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