COMPOUND DẪN ĐIỆN IC-PS30CD

COMPONENT AND PHYSICAL PROPERTY:

Items  Method of experiment  Unit  Value 
Carrier Resin  DSC    PS 
Carbon Black Content  ASTM D1603  %  30 
Melt Temperature  DSC  0C  150-170 
Density  ASTM D1895  g/cm3  1.13 
Melt Flow Index (2000C/5kg)  ASTM D1238  g/10 min  2.5 
Moisture content  ASTM D644  %  0.17 
Surface Resistivity    Ohm  105-106 

PROPERTIES:

Processing Technique: Injection molding, thermoforming 

Application Rate: 70-100% compound depending on requirement 

Packing: 20 kg/bag 

Storage: Keep at dry condition